Référence : BBNENUVO-7006DE-POE
Marque : Neousys
| System Core | |
| Processor | Supporting Intel® 8th-Gen Coffee Lake CPU (LGA1151 socket, 35W/ 65W TDP) - Intel® Core™ i7-8700/ i7-8700T - Intel® Core™ i5-8500/ i5-8500T - Intel® Core™ i3-8100/ i3-8100T - Intel® Pentium® G5400/ G5400T - Intel® Celeron® G4900/ G4900T |
| Chipset | Intel® Q370 Platform Controller Hub |
| Graphics | Integrated Intel® UHD Graphics 630 |
| Memory | Up to 32 GB DDR4 2666/ 2400 SDRAM (two SODIMM slots) |
| AMT | Supports AMT 12.0 |
| TPM | Supports TPM 2.0 |
| I/O Interface | |
| Ethernet Port | 2x Gigabit Ethernet ports by I219 and I210 |
| POE+ | 4x IEEE 802.3at PoE+ PSE 100 W total power budget |
| USB | 4x USB 3.1 Gen2 (10 Gbps) ports 4x USB 3.1 Gen1 (5 Gbps) ports |
| Video Port | 1x VGA connector, supporting 1920 x 1200 resolution 1x DVI-D connector, supporting 1920 x 1200 resolution 1x DisplayPort connector, supporting 4096 x 2304 resolution |
| Serial Port | 2x software-programmable RS-232/422/485 ports (COM1/ COM2) 2x RS-232 ports (COM3/ COM4) |
| Audio | 1x 3.5 mm jack for mic-in and speaker-out |
| Internal Expansion Bus | |
| PCI/PCI Express | 2x PCIe x8 slots@Gen3, 4-lanes PCIe signals in Cassette |
| Mini PCI-E | 1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA) |
| M.2 | 1x M.2 2242 B key socket with dual front-accessible SIM sockets, supporting dual SIM mode with selected M.2 LTE module |
| Expandable I/O | 1x MezIO™ expansion port for Neousys MezIO™ modules |
| Storage interface | |
| SATA HDD | 2x internal SATA port for 2.5" HDD/SSD installation, supporting RAID 0/ 1 |
| mSATA | 2x full-size mSATA port (mux with mini-PCIe) |
| M.2 NVMe | 1x M.2 2280 M key NVMe socket (PCIe Gen3/ x4) for NVMe SSD installation |
| Power Supply | |
| DC Input | 1x 3-pin pluggable terminal block for 8~35VDC DC input |
| Remote Ctrl. & LED Output | 1x 3-pin pluggable terminal block for remote control and PWR LED output |
| Mechanical | |
| Dimension | 240 mm (W) x 225 mm (D) x 110.5 mm (H) |
| Weight | 3.7 kg |
| Mounting | Wall-mounting (standard) or DIN-Rail mounting (optional) |
| Environmental | |
| Operating temperature | with 35W CPU -25°C ~ 70°C ** with 65W CPU -25°C ~ 70°C */** (configured as 35W TDP) -25°C ~ 50°C */** (configured as 65W TDP) |
| Storage temperature | -40°C ~ 85°C |
| Humidity | 10% ~ 90% , non-condensing |
| Vibration | Operating, MIL-STD-810G, Method 514.6, Category 4 |
| Shock | Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
| EMC | CE/FCC Class A, according to EN 55032 & EN 55024 |
Références spécifiques