PC modulaire compact - MB1-10AP
Référence : BBMIB1-10AP
Marque : MiTAC Computing Technology Corp.
PC industriel compact, fanless (sans ventilateur) et modulaire
Modules d'extension de ports COM, Vidéo,DIO...
Prend en charge les CPU Intel® Apollo Lake (N4200/N3350)
Mémoire 8GB DDR3L max.,2xCOM, HDMI, 1xGLAN, 2xGLAN POE
Alimentation 8~24 VDC, température étendue : de -25°C à 70°C
Dimensions : 170 x 57 x 105 mm, montage rail DIN ou Vesa
Powerful Apollo Lake Processor
- N4200 (2M Cache, up to 2.5 Ghz, TDP 6W)
- N3350 (2M Cache, up to 2.4 Ghz, TDP 6W)
1.48X Performance Improvement
(CPU Passmark)
Power Consumption Reduction
Lower Power Consumption Fanless Thermal
Design for Less Environmental Impact
Support 3 Ports LAN and 2 w/ PoE+ options
- Total supports 3 x Giga LAN
- 2 x LAN supports 802.3af and 802.3at PoE
Versatile Xpansion Modules
- Support HDMI + VGA, DVI, or DisplayPort
- Support power COM port &Digital I/O for iIoT application
MS-01VGA-D10
VGA Port Expansion Module
MS-01DVI-D10
DVI-D Port Expansion Module
MS-01DPN-D10
DisplayPort Expansion Module
MS-02COM-D10
Expansion Module with 2 x RS232 / 422 / 485 (support power 5V/12V)
MS-08DIO-T10
Expansion Module with 8-bit Isolated DIDO (4 x DI, 4 x DO)
Support Flexible Configuration For Dual Display
- Support HDMI as primary display
- Support secondary display (DisplayPort, DVI-D, or VGA) with Xpansion module options
- Increase the flexibility to aim at target markets
Advanced Power Protection
Wide Power Range
8V~24V
Reverse Power Input Protection
- Over Voltage Protection: 30V
- Over Current Protection: 16.6A
- ESD Protection: +/-15kV (air), +/-8kV (contact)
- Surge Protection: 3kW
-25~70oC Wide Temperature
MB1-10AP is designed in patented aluminum enclosure not only for aesthetic appearance but also for fan-less application in extreme temperature condition from -25℃ to 70℃.
Extreme Shock & Vibration Resistance
Shock Resistance
Operating, 50 Grms, Half-sine 11 ms Duration(w/ SSD, according to IEC60068-2-27)
Vibration Resistance
Operating, 5 Grms, 5-500 Hz, 3 Axes(w/ SSD, according to IEC60068-2-64)
Clear Installation Design
| MB1-10AP (MB1-10AP) Specifications | |||
| SYSTEM | CPU | Intel® Apollo Lake-M N4200 / N3350 Processor | |
| CHIPSET | Intel® SoC Integrated | ||
| SYSTEM MEMORY | MEMORYDDR3L 1866 MHz / 1 x 204-pin SO-DIMM / Max. 8GB (Non-ECC) | ||
| GRAPHICS | Intel® HD Graphics | ||
| DISPLAY INTERFACE | HDMI 1.4 / Optional DisplayPort/VGA/DVI-D by Expansion Module | ||
| STORAGE SLOT | 1 x 2.5 HDD / SSD (Default w/ HDD Bracket) / 1 x mSATA | ||
| ETHERNET | 2 x Intel® I210-IT Giga LAN (Optional 2 x Output PoE LAN support 802.3af and 802.3at. Maximum Power Budget 30W for dual port) / 1 x Realtek RTL8154 LAN (Up to 480Mbps) | ||
| AUDIO | Realtek® ALC662 / ALC888 | ||
| I/O CHIPSET | Nuvoton NCT6116D | ||
| TPM | Nuvoton NPCT750AAAYX TPM2.0 (Optional) | ||
| EXPANSION SLOT | LTE/Wireless: 1 x Mini PCIe Full size (USB2.0 / PCIeX1), w/ SIM Card Holder (w/ Full to Half size adapter plate) / Storage: mPCIe Full size (USB / PCIe / SATA) | ||
| INTERNAL SPEAKER | 1 x Buzzer | ||
| INDICATOR | Power Button / Power LED / HDD LED | ||
| FRONT I/O | 1 x HDMI 1.4 / 4 x USB 3.0 / 2 x SMA Antenna (Optional for WiFi/LTE function) / 1 x Xpansion Module Door / 2 x RS232 / 422 / 485 (Support Power 5V / 12V) | ||
| REAR I/O | 1 x 2-pin Header Remote Power on / off / 3 x RJ-45 / 1 x Mic-in / 1 x Line-out / 1 x 3-pin Terminal Block Power Input / 2 x SMA Antenna (Optional for WiFi/LTE function) | ||
| WATCHDOG TIMER | 1~255 steps by software program | ||
| EDGE AI ENGINE (Optional) | Hailo-8™ mPCIe (Model Name:MPE-01HAI-MB1) | ||
| POWER REQUIREMENT | POWER INPUT | 8~24V Wide Range DC Input w/ Terminal Block Connectivity | |
| POWER ADAPTER | Optional | ||
| ENVIRONMENTAL | OPERATING TEMPERATURE | -40 ~ 85°C (-40 ~185°F) | |
| STORAGE TEMPERATURE | -40 ~ 85°C (-40 ~185°F) | ||
| OPERATING HUMIDITY | 10% ~ 90% R/H (Non-condensing) | ||
| STORAGE HUMIDITY | 10% ~ 95% @85°C non-condensing | ||
| VIBRATION RESISTANCE | RESISTANCE Operating: 5Hz~500Hz / 5Grms / 3Axis (w/ SSD, according to IEC60068-2-64) | ||
| SHOCK RESISTANCE | Operating: 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27) | ||
| CERTIFICATION | CE / FCC Class A | ||
| MECHANICAL | THERMAL DESIGN | Fanless | |
| MOUNTING | Wallmount / 75 mm x 75 mm VESA Holes & Din Rail Mount Combo Kit (Optional) | ||
| DIMENSIONS (W X D X H)6.9” x 4.1” x 2.2” (170 x 105 x 57 mm) | |||
| WEIGHT | 1.3kg (2.8 lb) | ||
| OS | OS SUPPORT | Windows® 10 64-bit / Linux (support by request) | |
| PACKING LIST | PACKAGE | 1 x Quick Installation Guide / 1 x Embedded System / 1 x Wall Mount Brackets / 1 x 3 pin Terminal Block Power Connector / 1 x Full to Half Size mPCIe Card Adapter Plate | |
PC industriel compact, fanless (sans ventilateur) et modulaire
Modules d'extension de ports COM, Vidéo,DIO...
Prend en charge les CPU Intel® Apollo Lake (N4200/N3350)
Mémoire 8GB DDR3L max.,2xCOM, HDMI, 1xGLAN, 2xGLAN POE
Alimentation 8~24 VDC, température étendue : de -25°C à 70°C
Dimensions : 170 x 57 x 105 mm, montage rail DIN ou Vesa