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PC modulaire embarqué - MX1-10FEP

BBMIX1-10FEP-C246

MiTAC Computing Technology Corp.

PC fanless embarqué, chipset C246 (Intel®Xeon/Core/8 et 9Gen)
Extensions : DIO, COM, LAN, LAN PoE, option Ignition Control
Mémoire 32GB DDR4 max., 2xCOM, HDMI, DP, DVI-I, 2xLAN
Alimentation : 9~48 VDC, fonctionne de : -40°C à 70°C
Certifié : E-MARK E13, EN 50155, EN 50121
Dimensions : 268 x 246 x 108mm

Plus de détails

Powerful Coffee Lake-S Xeon Processor

Le PC intégré MX1-10FEP de MiTAC est un système embarqué de nouvelle génération avec le chipset de station de travail Intel® Coffee Lake C246 pouvant prendre en charge les processeurs Xeon et Core-i LGA1151. Doté d’un processeur puissant, d’une protection d'alimentation OCP / OVP, ce PC offre d’excellentes performances. De plus, grâce à sa conception extensible, ce système saura répondre aux tâches complexes pour un grand nombre d’applications.

La conception du châssis sans ventilateur du MX1-10FEP et la conception du module Xpandable lui permettent de mener à bien les tâches complexes et ce, pour chaque espace de travail et environnement. Le système de montage VESA permet un gain de place. La flexibilité signifie également une riche gamme de ports d'Entrées / Sorties (y compris 2 x Ethernet RJ45, 8 x USB, 1 x HDMI, 1 x DVI-I, 1 x DisplayPort, 2 x COM, slot PCIe X16, 3-pin Terminal Block Power Input et 3 x ports d'extension) pour ajouter une variété de périphériques. L'extensibilité du stockage est prise en charge pour 3 disques durs haute densité avec support de disque dur 2,5 pouces. Deux emplacements mPCIe (partagés avec mSATA) fournissent la prise en charge des interfaces SSD et sans fil qui permettent une connexion aux réseaux Wi-Fi et Bluetooth, ainsi que la connectivité 4G. Les modules d'extension DIO / COM / LAN / - PoE / Power Ignition permettent une utilisation pour encore plus d’applications.

Xeon

  • Up to 1.36X Performance Improvement compared to the previous generation
  • Fanless design with up to Xeon TDP 80W
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Core i

Up to 1.15X Performance Improvement compared to 7th generation

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Support ECC DDR4 Memory

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Versatile Xpansion Modules

Tested by major players specializing in the automation sector, the versatile Xpansion Module design, offers various I/O functionalities through its lower clever cost effective modulation, providing all functions within one system.

  • Versatile I/O connectivity. Up to 12 LAN, 10 PoE, 10 COM, 16 DIO
  • Power ignition Xpansion module for vehicle application

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MS-48CDN-DT10

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Expansion Module with 4 x RS232 / 422 / 485, 8-bit Isolated DIDO (4 x DI, 4 x DO)

MS-04LAN-R10

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Expansion Module with 4 x Intel i210-IT Giga LAN, RJ45 Port
 

MS-04LAN-M10

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Expansion Module with 4 x Intel i210-IT Giga LAN, M12 Port
 

MS-04POE-R10

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Expansion Module with 4 x PoE+, Intel i210-IT Giga LAN, RJ45 Port

MS-04POE-M10

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Expansion Module with 4 x PoE+, Intel i210-IT Giga LAN, M12 Port

ME-02POE-R10

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Expansion Module with 2 x PoE+, Intel i210-IT Giga LAN, RJ45 Port

MS-01IGN-S10

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Vehicle Power Ignition Card, 12V/24V and Power ON/OFF Timing Selectable

 
 
 

Edge AI Accelerator

4 X Intel® Movidius™ Myriad™ X for Edge AI

MX1-10FEP with AI modules powered by Intel® Movidius™ Myriad™ X creates the possibility to be implemented in more Edge AI solutions, for example, traffic flow monitoring and real-time decision, manufacturing yield rate improvement via AI algorithm, remote healthcare service, and efficient transportation.
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Maximum AI Cores:
Up to 4 x Movidius Myriad X
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Support Intel OpenVINO Toolkit
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Supported Framework:
TensorFlow, Caffe, MXNET
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Supports High Resolution Triple Display

Supports triple independent displays (VGA + HDMI+DVI). The HDMI & DisplayPort up to 4K high resolution. The enhanced visual quality responses the demand of being high precise.

  • Display Port 1.2 (4K@60Hz)
  • HDMI 1.4 (4K@30Hz)
  • DVI-I (FHD@60Hz)

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Advanced Power Protection

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Wide Power Range

9V~48V

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Protection

  • Reverse Power Input Protection
  • Over Voltage Protection: 58V
  • Over Current Protection: 15A
  • ESD Protection: +/-15kV (air), +/-8kV (contact)
  • Surge Protection: 3kW
 

-40~70oC Wide Temperature

MX1-10FEP is designed in patented aluminum enclosure not only for atheistic appearance but also for fan-less application in extreme temperature condition from 40 oCC to 70 oCC.

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Certificate

MX1-10FEP are certified and all units undergo severe environmental testing to ensure reliable performance under a variety of automation conditions.

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Dimension (mm)

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MX1-10FEP I/O

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MX1-10FEP (MX1-10FEP) Specifications
SYSTEMCPU9th & 8th Gen Intel® Coffee Lake Xeon LGA1151 Socket Processor, 6-core TDP Max. 80W / 9th & 8th Gen Intel® Coffee Lake LGA1151 Socket Processor, Core i7/i5/i3 6-core TDP Max. 65W, Core i9 8-core TDP Max 35W / *Please see the CPU Options in Docs / Manuals
CHIPSETIntel® C246
SYSTEM MEMORYMax. 32GB (Xeon: ECC / Non-ECC; Core-i: Non-ECC) / DDR4 2666MHz / 2 x 260-pin SO-DIMM
GRAPHICSIntel® HD Graphics
DISPLAY INTERFACEDisplayPort 1.2 / DVI-I / HDMI 1.4
STORAGE SLOT3 x 2.5 HDD / SSD (1 w/ Removable HDD Bay, 2 w/ Internal HDD Bracket) / 2 x mSATA / 1 x M.2 M Key SSD
ETHERNETIntel® I219-LM Giga LAN + I210-IT Giga LAN
AUDIORealtek® ALC662
I/O CHIPSETNuvoton NCT6116D
TPMNuvoton NPCT750AAAYX TPM2.0
EXPANSION SLOTStorage: M.2 2280 / 2260 / 2242 M key (PCIe, SATA) / PCIe 3.0 X16 slot / Storage/LTE/Wireless: 2 x mPCIe Full / Half size (USB / PCIe / SATA), w/ SIM Card Holder / Wireless: M.2 2230 E key (PCIe, USB)
INTERNAL SPEAKER1 x Buzzer
INDICATORDIO LED / LAN1 & 2 ACT / SPEED / Power LED / HDD LED
FRONT I/O1 x HDMI 1.4 / 2 x USB 3.0 / 2 x SIM Card Slot w/ Cover / 1 x 2.5" SATAIII HDD / SSD Bay
REAR I/O1 x DisplayPort 1.2 / 1 x DVI-I / 2 x RJ-45 / 4 x USB 3.1 Gen 2 (10 Gbps) / 2 x USB 2.0 / 2 x RS232 / 422 / 485 (Support Power 5V / 12V) / 1 x Mic-in / 1 x Line-out / 1 x PS/2 / 1 x PCIe x16 slot / 1 x 2-pin Terminal Block Remote Power Reset / 1 x 3-pin Terminal Block Power Input / 1 x 4-pin Terminal Block External Fan Connector / 1 x 2-pin Terminal Block Remote Power on / off / 4 x SMA Antenna (Optional for WiFi/LTE function)
POWER REQUIREMENTPOWER INPUT9~48V Wide Range DC Input w/ Terminal Block Connectivity
POWER ADAPTEROptional
ENVIRONMENTALOPERATING TEMPERATURE35W TDP Processor: -40°C to 70°C / 51~65W TDP Processor: -40°C to 50°C / 71~80W TDP Processor: -40°C to 40°C / with 0.7m/s Air Flow and Wide Temperature Memory/Storage
STORAGE TEMPERATURE-40 ~ 85°C (-40 ~185°F)
OPERATING HUMIDITY10% ~ 90% R/H (Non-condensing)
STORAGE HUMIDITY10% ~ 95% @85°C non-condensing
VIBRATION RESISTANCEOperating: 5Hz~500Hz / 5Grms / 3Axis (w/ SSD, according to IEC60068-2-64)
SHOCK RESISTANCEOperating: 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27)
CERTIFICATIONCE / FCC Class A / E-Mark Certification (E13, No.10R-0515319) / EN50155
MECHANICALTHERMAL DESIGNFanless
MOUNTINGWallmount
DIMENSIONS (W X D X H)10.6” x 9.7” x 4.3” (268 x 246 x 108 mm)
WEIGHT6kg
OSOS SUPPORTWindows® 10 64-bit / Linux (support by request)
PACKING LISTPACKAGE1 x Driver CD / 1 x Quick Installation Guide / 1 x Embedded System / 1 x CPU Cooler (passive) / 1 x Wall Mount Brackets (2PCS in 1 set) / 1 x 3 pin Terminal Block Power Connector / 1 x 4 pin Terminal Block Male Connector / 2 x 2 pin Terminal Block Male Connector / 1 x DVI to VGA converter / 1 x 30 cm SATA & SATA PWR Cable